The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Mar. 26, 2014
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Phil Nikkel, Loveland, CO (US);

Stefan Bader, Fort Collins, CO (US);

Robert Thalhammer, Bavaria, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H01L 41/18 (2006.01); H03H 3/04 (2006.01); H01L 21/768 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H01L 21/76807 (2013.01); H01L 21/76814 (2013.01); H01L 41/18 (2013.01); H01L 41/183 (2013.01); H03H 3/04 (2013.01); H03H 9/172 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01); H03H 2003/021 (2013.01); H03H 2003/023 (2013.01); H03H 2003/025 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method is provided for fabricating a bulk acoustic wave (BAW) resonator device. The method includes forming an etch stop layer over a bottom electrode and a substrate; forming a dielectric layer on the etch stop layer; forming a photomask over the dielectric layer defining an opening over the bottom electrode; etching a portion the dielectric layer through the opening of the photomask to the etch stop layer to create a corresponding opening in the dielectric layer; removing the photomask, leaving un-etched protruding portions of the dielectric layer around the opening in the dielectric layer; and removing the protruding portions of the dielectric layer, a portion of the etch stop layer located over the bottom electrode, and a minimal portion of the bottom electrode to provide a planarized surface including a top surface of the bottom electrode and an adjacent top surface of the dielectric layer deposited over the substrate.


Find Patent Forward Citations

Loading…