The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

May. 23, 2014
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ofer Markish, Emek Hefer-Beerotaim, IL;

Alon Yehezkely, Haifa, IL;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/48 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 21/20 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0025 (2013.01); H01Q 1/48 (2013.01); H01Q 21/0093 (2013.01); H01Q 21/067 (2013.01); H01Q 21/205 (2013.01); H01Q 23/00 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.


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