The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Apr. 28, 2015
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Inventors:

Jiuxia Yang, Beijing, CN;

Feng Bai, Beijing, CN;

Ruiyong Wang, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); B32B 37/14 (2006.01); C03B 23/203 (2006.01); H01L 33/48 (2010.01); H01L 51/56 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/529 (2013.01); H01L 51/5246 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 51/0048 (2013.01); H01L 2251/301 (2013.01);
Abstract

The present disclosure provides a packaging method, a packaging structure and a display device. The packaging method comprises forming a pattern of a packaging adhesive on a packaging area of a first substrate, and forming a heat dissipating structure on the packaging area of any of the first substrate and a second substrate; attaching the first substrate and the second substrate, and aligning the packaging area of the first substrate with that of the second substrate; illuminating the pattern of the packaging adhesive by a laser beam to melt and frit it, so as to form a packaging adhesive structure between the first and second substrates. In the present invention, in the case that the heat dissipating structure is manufactured on the packaging area, when the packaging adhesive is illuminated by the laser beam to be melted, the heat dissipating structure can quickly dissipate the heat, effectively suppress the rapid increase of the substrate temperature caused by the laser illumination, and reduce the damage to the drive back plate.


Find Patent Forward Citations

Loading…