The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
May. 25, 2012
Applicants:
Joon Ho Jung, Hwaseong-si, KR;
Jeong Og Choi, Seoul, KR;
OH Kwan Kwon, Anyang-si, KR;
Ah Reum Hwang, Seoul, KR;
Inventors:
Joon Ho Jung, Hwaseong-si, KR;
Jeong Og Choi, Seoul, KR;
Oh Kwan Kwon, Anyang-si, KR;
Ah Reum Hwang, Seoul, KR;
Assignee:
LMS Co., Ltd., Pyeongtaek-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/54 (2006.01); C09K 11/06 (2006.01); H01L 51/00 (2006.01); C07D 209/82 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0058 (2013.01); C07D 209/82 (2013.01); H01L 51/006 (2013.01); H01L 51/0061 (2013.01); H01L 51/0068 (2013.01); H01L 51/0072 (2013.01); H01L 51/008 (2013.01); H01L 51/5056 (2013.01); H01L 51/5088 (2013.01);
Abstract
Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.