The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Dec. 10, 2014
Applicant:

Ngk Insulators, Ltd., Aichi, JP;

Inventors:

Yuji Hori, Owariasahi, JP;

Tomoyoshi Tai, Inazawa, JP;

Akira Hamajima, Nagoya, JP;

Toshinao Nakahara, Kasugai, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); H03H 9/25 (2006.01); H01L 41/08 (2006.01); H03H 9/02 (2006.01); H01L 41/22 (2013.01); H03H 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0805 (2013.01); H01L 41/22 (2013.01); H03H 9/02574 (2013.01); H03H 3/08 (2013.01); Y10T 428/2495 (2015.01);
Abstract

A composite substrateincludes a piezoelectric substrateand a support layerbonded to the piezoelectric substrate. The support layeris made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate. The piezoelectric substrateand the support layerare bonded together with an adhesive layertherebetween. The composite substratehas a total thickness of 180 μm or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate, and t2 is the thickness of the support layer. The thickness t1 is 100 μm or less. The thickness t2 is 50 μm or less.


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