The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Nov. 15, 2012
Applicants:

Hitachi Cable, Ltd., Tokyo, JP;

Inter-university Research Institute Corporation, Ibaraki, JP;

National Institute for Materials Science, Ibaraki, JP;

Inventors:

Takao Takeuchi, Ibaraki, JP;

Kiyosumi Tsuchiya, Ibaraki, JP;

Kazuhiko Nakagawa, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01L 39/12 (2006.01); H01L 39/14 (2006.01); H01B 13/00 (2006.01); H01B 12/02 (2006.01);
U.S. Cl.
CPC ...
H01L 39/12 (2013.01); H01L 39/14 (2013.01); H01L 39/2403 (2013.01); H01L 39/2409 (2013.01); H01B 12/02 (2013.01); H01B 13/00 (2013.01); Y10T 428/12819 (2015.01);
Abstract

Problem There is proposed an innovative cross-sectional structure, with an idea contrary to the conventional one, utilizing the non-reactivity between Cu and Ta (or between Ag and Nb, Ta) in a high-temperature short-time heat treatment, thus achieving (1) the suppression of the low magnetic-field instability, (2) excellent wire drawability of a precursor wire, and (3) the reduction of the cost required for the incorporation of a stabilizer. Means for Resolution There is proposed a structure having an assembly of a plurality of single wires, wherein the assembly is covered with an outer cover (skin) formed from Nb or Ta, wherein each of the single wires has an Nb/Al composite filament region which is formed from a composite of Nb and Al mixed in an Nb:Al molar ratio of 3:1, and which is covered with a partition formed from Nb or Ta, and further covered with an interfilamentary barrier formed from Cu or Ag disposed around the partition.


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