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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9680075 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Aug. 30, 2013

Light-emitting device

Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Yoji Urano, Osaka, JP;

Akifumi Nakamura, Osaka, JP;

Hayato Ioka, Osaka, JP;

Toru Hirano, Osaka, JP;

Masanori Suzuki, Osaka, JP;

Hideaki Hyuga, Osaka, JP;

Ryoji Imai, Osaka, JP;

Jun Goda, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Trung Q Dang

Assistant Examiner:

Patricia Reddington

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); F21K 9/00 (2016.01); F21S 8/02 (2006.01); F21V 29/76 (2015.01); F21V 29/89 (2015.01); F21Y 101/00 (2016.01); F21K 9/27 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/502 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); F21K 9/00 (2013.01); F21K 9/27 (2016.08); F21S 8/02 (2013.01); F21V 29/763 (2015.01); F21V 29/89 (2015.01); F21Y 2101/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.

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