The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Dec. 19, 2014
Applicant:
Solexel, Inc., Milpitas, CA (US);
Inventors:
Mehrdad M. Moslehi, Los Altos, CA (US);
David Xuan-Qi Wang, Fremont, CA (US);
Assignee:
Solexel, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01); H01L 31/0468 (2014.01); H01L 27/142 (2014.01); H01L 31/0224 (2006.01); H01L 31/054 (2014.01); H01L 31/056 (2014.01);
U.S. Cl.
CPC ...
H01L 31/03529 (2013.01); H01L 27/142 (2013.01); H01L 31/022458 (2013.01); H01L 31/035281 (2013.01); H01L 31/0468 (2014.12); H01L 31/1804 (2013.01); H01L 31/1892 (2013.01); H01L 31/054 (2014.12); H01L 31/056 (2014.12); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract
A three-dimensional thin-film semiconductor substrate with selective through-holes is provided. The substrate having an inverted pyramidal structure comprising selectively formed through-holes positioned between the front and back lateral surface planes of the semiconductor substrate to form a partially transparent three-dimensional thin-film semiconductor substrate.