The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Oct. 25, 2013
Applicant:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Inventors:

Toshihiko Uto, Settsu, JP;

Daisuke Adachi, Settsu, JP;

Assignee:

KANEKA CORPORATION, Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01L 31/0465 (2014.01); H01L 31/0747 (2012.01); H01L 31/18 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022433 (2013.01); H01L 31/022425 (2013.01); H01L 31/022466 (2013.01); H01L 31/0465 (2014.12); H01L 31/0747 (2013.01); H01L 31/1864 (2013.01); H01L 31/1884 (2013.01); H01L 31/202 (2013.01); Y02E 10/50 (2013.01);
Abstract

A solar cell of the present invention includes a collecting electrode on one main surface of a photoelectric conversion section. The collecting electrode includes first and second electroconductive layers in this order from the photoelectric conversion section side, and an insulating layer between the first and second electroconductive layers, the insulating layer having an opening section formed therein. The first electroconductive layer is covered with the insulating layer, contains a low-melting-point material, and is conductively connected with a part of the second electroconductive layer via the opening section. The surface roughness of the second electroconductive layer is preferably 1.0 μm to 10.0 μm. The second electroconductive layer is preferably formed by a plating method. In order to conductively connect the first and second electroconductive layers, annealing of the first electroconductive layer by heating is preferably performed prior to forming the second electroconductive layer.


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