The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jan. 24, 2014
Applicants:

Daeik Kim, Hwaseong-si, KR;

Jiyoung Kim, Yongin-si, KR;

Jemin Park, Suwon-si, KR;

Nakjin Son, Suwon-si, KR;

Yoosang Hwang, Suwon-si, KR;

Inventors:

Daeik Kim, Hwaseong-si, KR;

Jiyoung Kim, Yongin-si, KR;

Jemin Park, Suwon-si, KR;

Nakjin Son, Suwon-si, KR;

Yoosang Hwang, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 21/8234 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 21/823437 (2013.01); H01L 29/7827 (2013.01); H01L 29/7831 (2013.01); H01L 21/26586 (2013.01);
Abstract

According to a method of manufacturing a semiconductor device, hard mask lines are formed in parallel in a substrate and the substrate between the hard mask lines is etched to form grooves. A portion of the hard mask line and a portion of the substrate between the grooves are etched. A top surface of the etched portion of the substrate between the grooves is higher than a bottom surface of the groove. A conductive layer is formed to fill the grooves. The conductive layer is etched to form conductive patterns in the grooves, respectively.


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