The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Aug. 09, 2016
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventor:
Hiroaki Sekikawa, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 24/45 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0218 (2013.01); H01L 2224/0219 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/4502 (2013.01); H01L 2224/45147 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract
To provide a semiconductor device having improved reliability. The semiconductor device is equipped with a first polyimide film, rewirings formed over the first polyimide film, first and second dummy patterns formed over the first polyimide film, a second polyimide film that covers the rewirings and the dummy patterns, and an opening portion that exposes a portion of the rewirings in the second polyimide film. The first dummy pattern is, in plan view, comprised of a closed pattern surrounding the rewirings while having a space therebetween.