The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jan. 08, 2016
Applicant:

J-metrics Technology Co., Ltd., Taipei, TW;

Inventor:

Wei-Ting Lin, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); H05K 1/181 (2013.01); H05K 3/32 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1305 (2013.01);
Abstract

A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip.


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