The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jun. 03, 2015
Applicants:

Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, CN;

General Interface Solution Limited, Miaoli County, TW;

Inventors:

Hung-Chieh Lu, Guangdong, CN;

Yen-Heng Huang, Guangdong, CN;

Chung-Kai Chen, Guangdong, CN;

Shih-Chieh Huang, Guangdong, CN;

Li-Ting Cheng, Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06F 3/043 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G06F 3/043 (2013.01); G06F 2203/04103 (2013.01); G06K 9/00 (2013.01);
Abstract

The present disclosure provides an acoustic wave fingerprint recognition unit including a sensor circuit substrate, a film adhesive layer positioned on the sensor circuit substrate, a piezoelectric material layer positioned on the film adhesive layer and a protection layer positioned on the piezoelectric material layer. The film adhesive layer is formed of a film adhesive material, and the film adhesive material is composed of a film adhesive agent and an organic solvent. The film adhesive agent is an epoxy resin, and the organic solvent is a C3-C8 and carbonyl-containing organic solvent. The solid content of the film adhesive agent in the film adhesive material is in a range of 1%-90%. A method for manufacturing the acoustic wave fingerprint recognition unit is also provided herein.


Find Patent Forward Citations

Loading…