The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jan. 29, 2013
Applicant:

Multidimension Technology Co., Ltd., Zhangjiagang, CN;

Inventors:

Jianmin Bai, Zhangjiagang, CN;

James Geza Deak, Zhangjiagang, CN;

Mingfeng Liu, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/14 (2006.01); G01R 33/09 (2006.01); G01R 33/022 (2006.01); G01R 17/00 (2006.01);
U.S. Cl.
CPC ...
G01R 33/098 (2013.01); G01R 17/00 (2013.01); G01R 33/022 (2013.01); G01R 33/09 (2013.01); G01R 33/093 (2013.01);
Abstract

Disclosed is a magnetoresistive magnetic field gradient sensor, comprising a substrate, a magnetoresistive bridge and a permanent magnet respectively disposed on the substrate; the magnetoresistive bridge comprises two or more magnetoresistive arms; each magnetoresistive arm consists of one or more magnetoresistive elements; each magnetoresistive element is provided with a magnetic pinning layer; the magnetic pinning layers of all the magnetoresistive elements have the same magnetic moment direction; the permanent magnet is disposed adjacent to each magnetoresistive arm to provide a bias field, and to zero the offset of the response curve of the magnetoresistive element; the magnetoresistive gradiometer includes wire bonding pads that can be electrically interconnected using wire bonding to an ASIC or to the lead frame of a semiconductor chip package.


Find Patent Forward Citations

Loading…