The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Mar. 18, 2014
Applicant:
Semitec Corporation, Tokyo, JP;
Inventors:
Tadashi Matsudate, Tokyo, JP;
Shuji Inamura, Tokyo, JP;
Assignee:
SEMITEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/18 (2006.01); A61B 18/14 (2006.01); G01L 5/16 (2006.01); A61B 18/00 (2006.01); A61B 90/00 (2016.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); A61B 18/1492 (2013.01); G01L 5/162 (2013.01); A61B 2018/00351 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00595 (2013.01); A61B 2018/00773 (2013.01); A61B 2090/065 (2016.02); A61B 2090/376 (2016.02);
Abstract
Provided is a contact force sensor of high sensitivity and high accuracy. This contact force sensor is fabricated by machining of a silicon semiconductor material. The contact force sensor is provided with a sensor configuration having a base part, and a contact force transmission part formed in a direction orthogonal to this base part. A stress-electricity conversion element for converting displacement of the contact force transmission part to an electrical signal, formed in the base part of the sensor configuration, is also provided.