The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Aug. 01, 2014
Toray Industries, Inc., Tokyo, JP;
Hiroshi Kobayashi, Nagoya, JP;
Takahiko Otsubo, Nagoya, JP;
Hiroshi Takezaki, Nagoya, JP;
Nobuyuki Tomioka, Nagoya, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
Abstract
[Problem] To provide: a fiber-reinforced composite material having both Mode I interlaminar fracture toughness and compressive strength under wet heat conditions; an epoxy resin composition for producing the fiber-reinforced composite material; and a prepreg produced using the epoxy resin composition. [Solution] An epoxy resin composition comprising at least the following constituents [A], [B] and [C]: [A] an epoxy resin; [B] composite polyamide microparticles which satisfy such a requirement (b1) the materials constituting the particles are a polyamide (B1) and a thermoplastic elastomer resin (B2), such a requirement (b2) that the melting point or the glass transition temperature of the polyamide (B1) is higher than 100° C. and such a requirement (b3) the number average particle diameter is 0.1 to 100 μm; and [C] a curing agent.