The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jan. 24, 2014
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yuko Shimizu, Otsu, JP;

Hiroshi Kobayashi, Nagoya, JP;

Nobuyuki Tomioka, Nagoya, JP;

Hiroshi Takezaki, Nagoya, JP;

Shirou Honda, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/04 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 77/00 (2006.01); C08L 29/04 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08J 5/24 (2013.01); C08L 29/04 (2013.01); C08L 77/00 (2013.01); C08J 2363/00 (2013.01);
Abstract

The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G' of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G′ of the material constituting the particles at 160° C. to the storage elastic modulus G′ of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].


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