The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Oct. 31, 2014
Applicants:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Yuxia Liu, Dayton, NJ (US);
Mark Konarski, Old Saybrook, CT (US);
Charles W. Paul, Morristown, NJ (US);
Peter D. Palasz, Berks, GB;
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/20 (2006.01); H01L 51/52 (2006.01); H01B 3/44 (2006.01); H01L 51/44 (2006.01); H01L 51/56 (2006.01); C08L 23/22 (2006.01);
U.S. Cl.
CPC ...
C08L 23/20 (2013.01); C08L 23/22 (2013.01); H01B 3/441 (2013.01); H01L 51/448 (2013.01); H01L 51/5246 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); H01B 3/447 (2013.01);
Abstract
The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.