The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Jun. 09, 2015
Applicants:

Hai Du, East Amherst, NY (US);

Scot E. Jaynes, Lockport, NY (US);

Steven R. Falta, Honeoye Falls, NY (US);

Neil A. Stephenson, East Amherst, NY (US);

Inventors:

Hai Du, East Amherst, NY (US);

Scot E. Jaynes, Lockport, NY (US);

Steven R. Falta, Honeoye Falls, NY (US);

Neil A. Stephenson, East Amherst, NY (US);

Assignee:

PRAXAIR TECHNOLOGY, INC., Danbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/04 (2006.01); C01B 23/00 (2006.01); F25J 3/04 (2006.01); F25J 3/08 (2006.01);
U.S. Cl.
CPC ...
C01B 23/0078 (2013.01); B01D 53/0438 (2013.01); B01D 53/0462 (2013.01); F25J 3/04775 (2013.01); F25J 3/08 (2013.01); B01D 2256/18 (2013.01); B01D 2257/102 (2013.01); B01D 2257/104 (2013.01); B01D 2259/402 (2013.01); C01B 2210/0034 (2013.01); C01B 2210/0045 (2013.01); F25J 2205/64 (2013.01);
Abstract

The present invention generally relates to a method to enhance heat transfer in the temperature swing adsorption process (TSA) and to an intensified TSA process for gas/liquid purification or bulk separation. Helium is designed as the heat carrier media to directly bring heat/cool to the adsorbent bed during the TSA cycling process. With helium's superior heat conductivity, the time consuming regeneration steps (warming, regeneration and precooling) of TSA process can be significantly reduced and allowing for the TSA process to be intensified.


Find Patent Forward Citations

Loading…