The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Feb. 24, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Ryota Tomiyama, Aichi, JP;

Maki Kondou, Osaka, JP;

Hideki Oka, Mie, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60L 11/18 (2006.01); H01R 13/56 (2006.01); H01R 13/58 (2006.01); H01R 13/405 (2006.01); H02J 7/00 (2006.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
B60L 11/1818 (2013.01); H01R 13/405 (2013.01); H01R 13/56 (2013.01); H01R 13/58 (2013.01); H02J 7/0045 (2013.01); B60L 11/18 (2013.01); H01R 13/52 (2013.01); Y02T 10/7005 (2013.01); Y02T 90/121 (2013.01);
Abstract

The first molded part and the second molded part are molded products of synthetic resin materials. The first molded part is made of a synthetic resin material having a higher creep resistance than a synthetic resin material forming the second molded part. The second molded part is made of a synthetic resin material higher than a synthetic resin material forming the first molded part in adhesion to a material forming the receiver contact.


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