The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Oct. 31, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Garrett E. Clark, Corvallis, OR (US);

Chris Bakker, Corvallis, OR (US);

Mark H. MacKenzie, Corvallis, OR (US);

Glenn D. McCloy, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/15 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A print head die may include a substrate, an electrical connector and at least three liquid feed slots. The electrical connector is on a first side of the substrate and extends along the major dimension of the substrate. The electrical connector is connectable directly to an electrical interconnect to connect the print head die to a controller. The at least three liquid feed slots are formed in the substrate and extend along the major dimension of the substrate. Wherein at least one and less than all of the at least three liquid feed slots has an associated temperature sensor connected to the electrical connector.


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