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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9676060 B1

PDFFull Text
Date of Patent:
Jun. 13, 2017

Filed:

Sep. 20, 2013

Method for treating cu thin sheet

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Naokuni Muramatsu, Nagoya, JP;

Shoju Aoshima, Fujieda, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

David Turocy

Assistant Examiner:

Mohammad Mayy

Int. Cl.
CPC ...
B23K 26/32 (2014.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); C23C 24/10 (2006.01); C22C 9/00 (2006.01); C22C 9/06 (2006.01); C22C 16/00 (2006.01); C22C 19/05 (2006.01); C22C 19/07 (2006.01); C22C 45/10 (2006.01); B23K 35/30 (2006.01); B23K 26/342 (2014.01); B23K 103/12 (2006.01); B22F 7/04 (2006.01); C22C 1/04 (2006.01); C22C 32/00 (2006.01); B23K 103/18 (2006.01); B23K 103/04 (2006.01);
U.S. Cl.
CPC ...
B23K 26/32 (2013.01); B22F 7/04 (2013.01); B23K 26/342 (2015.10); B23K 35/007 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/3033 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22C 16/00 (2013.01); C22C 19/056 (2013.01); C22C 19/058 (2013.01); C22C 19/07 (2013.01); C22C 45/10 (2013.01); C23C 24/10 (2013.01); B22F 2007/047 (2013.01); B22F 2998/00 (2013.01); B22F 2998/10 (2013.01); B23K 2203/05 (2015.10); B23K 2203/12 (2013.01); B23K 2203/18 (2013.01); B23K 2203/26 (2015.10); C22C 1/0433 (2013.01); C22C 1/0458 (2013.01); C22C 32/0052 (2013.01);
Abstract

A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters Dof both DBA and RM employed fall within 0.1 to 100 μm, the median diameter Dof DBA is larger than the median diameter Dof RM, and both the distribution ratio D/Dof DBA and the distribution ratio D/Dof RM are 4.0 or less.

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