The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9674987 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 06, 2017

Filed:

Nov. 13, 2013
Applicant:

Zte Corporation, Shenzhen, CN;

Inventor:

Fangxi Hou, Shenzhen, CN;

Assignee:

ZTE CORPORATION, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H05K 7/20 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01R 12/722 (2013.01); H05K 7/20418 (2013.01);
Abstract

Provided is a heat dissipation device. The heat dissipation device includes a thermal conductive plate (), a shape of which is the same as a shape of a Secure Digital (SD) card. The thermal conductive plate () is used to be inserted into an SD card connector, and partially contacts with at least one inner surface of the SD card connector; the thermal conductive plate () is made of thermal conductive metallic material, and one or more contacting parts () of the thermal conductive plate () that contact with the SD card connector are set to be thermal conductive metallic material, and outer surfaces (), other than the one or more contacting parts (), of the thermal conductive plate () are set to be insulating material. The present technical solution solves the problem that the implementing effect of heat dissipation schemes already existed for terminals is fairly bad in the related technologies, and improves heat conduction and heat dissipation speed. The heat dissipation device occupies less space in the terminal, and enhances heat dissipation efficiency.


Find Patent Forward Citations

Hou, Fangxi. (2017). Heat dissipation device (U.S. Patent No. 9674987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9674987

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