The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Nov. 26, 2012
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Issei Yamamoto, Nagaokakyo, JP;
Akihiko Kamada, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile