The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Apr. 24, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Ha Il Kim, Suwon-Si, KR;

Dong Gi An, Suwon-Si, KR;

Su Hyun Park, Suwon-Si, KR;

Young Man Kim, Suwon-Si, KR;

Jong Hyung Kim, Suwon-Si, KR;

Kyung Chul Yu, Suwon-Si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 1/028 (2013.01); H05K 1/0278 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 3/30 (2013.01); H05K 2201/05 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09127 (2013.01); Y10T 29/49126 (2015.01); Y10T 29/49131 (2015.01); Y10T 29/49156 (2015.01);
Abstract

There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.


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