The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Oct. 27, 2011
Ravi Palaniswamy, Singapore, SG;
Arokiaraj Jesudoss, Singapore, SG;
Alejandro Aldrin IL Agcaoili Narag, Singapore, SG;
James R. White, Singapore, SG;
Fong Liang Tan, Singapore, SG;
Andrew J. Ouderkirk, St. Paul, MN (US);
Justine A. Mooney, Austin, TX (US);
Nathan P. Kreutter, Austin, TX (US);
Qihong Nie, Woodbury, MN (US);
Jian Xia Gao, Singapore, SG;
Ravi Palaniswamy, Singapore, SG;
Arokiaraj Jesudoss, Singapore, SG;
Alejandro Aldrin Il Agcaoili Narag, Singapore, SG;
James R. White, Singapore, SG;
Fong Liang Tan, Singapore, SG;
Andrew J. Ouderkirk, St. Paul, MN (US);
Justine A. Mooney, Austin, TX (US);
Nathan P. Kreutter, Austin, TX (US);
Qihong Nie, Woodbury, MN (US);
Jian Xia Gao, Singapore, SG;
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
Provided is a flexible light emitting semiconductor device (), such as an LED device, that includes a flexible dielectric layer () having first and second major surfaces and at least one via () extending through the dielectric layer from the first to the second major surface, with a conductive layer () on each of the first and second major surfaces and in the via. The conductive layer () in the via supports a light emitting semiconductor device () and is electrically isolated from the conductive layer () on the first major surface of the dielectric layer.