The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Dec. 07, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Christian Herzum, Starnberg, DE;
Martin Wurzer, Munich, DE;
Roland Helm, Munich, DE;
Michael Kropfitsch, Koettmannsdorf, AT;
Stefan Barzen, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 29/00 (2006.01); H03K 3/01 (2006.01); H04R 19/04 (2006.01); B81C 1/00 (2006.01); B81C 99/00 (2010.01); H03G 3/30 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H03K 3/01 (2013.01); B81C 1/0023 (2013.01); B81C 99/0045 (2013.01); H03G 3/3005 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 29/006 (2013.01); H04R 2201/003 (2013.01);
Abstract
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.