The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Dec. 21, 2015
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

David R. Fletcher, Allen, TX (US);

David D. Heston, Dallas, TX (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/60 (2006.01); H03F 1/02 (2006.01); H03F 1/56 (2006.01); H03F 3/193 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H03F 1/565 (2013.01); H03F 3/193 (2013.01); H03F 2200/451 (2013.01); H03F 2200/555 (2013.01);
Abstract

Off-chip distributed drain biasing increases output power and efficiency for high power distributed amplifier MMICs. An off-chip bias circuit has a common input for receiving DC bias current and a plurality of parallel-connected bias chokes among which the DC bias current is divided. The chokes are connected to a like plurality of drain terminals at different FET amplifier stages to supply DC bias current at different locations along the output transmission line. Off-chip distributed drain biasing increases the level of DC bias current that can be made available to the amplifier and add inductances to selected FET amplifier stages, typically the earlier stages, to modify the load impedance seen at the drain terminal to better match the amplifier stages to improve power and efficiency.


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