The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

May. 28, 2015
Applicant:

Berliner Glas Kgaa Herbert Kubatz Gmbh & Co., Berlin, DE;

Inventor:

Oliver Baldus, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); H01L 21/683 (2006.01); B23K 35/30 (2006.01); B23K 1/00 (2006.01); B23K 35/32 (2006.01); B23K 1/19 (2006.01); H01L 21/687 (2006.01); B23K 35/40 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/22 (2006.01); B23K 35/24 (2006.01); B23K 101/20 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); B23K 1/00 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); B23K 35/00 (2013.01); B23K 35/0205 (2013.01); B23K 35/0222 (2013.01); B23K 35/0238 (2013.01); B23K 35/222 (2013.01); B23K 35/24 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/325 (2013.01); B23K 35/402 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/6875 (2013.01); B23K 2201/20 (2013.01); B23K 2201/40 (2013.01);
Abstract

A holding apparatus () for electrostatically holding a component (), in particular a silicon wafer, includes at least one base body (A,B) which is composed of a first plate (A) and a second plate (), the first plate (A) being arranged on an upper side (A) of the base body (A,B) and the second plate are made of an electrically insulating material, a plurality of projecting, upper burls (A) which are arranged on the upper side (A) of the base body (A,B) and form a support surface for the component (), and a first electrode which is arranged to receive a clamping voltage, wherein the first plate (A) is made of an electrically conductive, silicon-including ceramic and forms the first electrode. A method for producing the holding apparatus () is also described.


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