The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

May. 09, 2013
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yoshifumi Saka, Yokkaichi, JP;

Hajime Watanabe, Yokkaichi, JP;

Mikio Satou, Yokkaichi, JP;

Masayuki Ookubo, Yokkaichi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); C25D 7/00 (2006.01); C25D 3/60 (2006.01); C25D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 7/00 (2013.01); C25D 3/60 (2013.01); C25D 5/12 (2013.01);
Abstract

The present invention aims to provide a plated terminal for connector which requires a smaller insertion force by reducing a friction coefficient and a terminal pair formed using such a plated terminal for connector. An alloy containing layer () made of tin and palladium and containing a tin-palladium alloy is formed on a surface of a terminal base material () made of copper or copper alloy. Here, the alloy containing layer () is preferably such that domain structures of a first metal phase () made of an alloy of tin and palladium are formed in a second metal phase () made of pure tin or an alloy having a higher ratio of tin to palladium than in the first metal phase ().


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