The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Jun. 29, 2016
Applicant:

Wisconsin Alumni Research Foundation, Madison, WI (US);

Inventors:

Michael Scott Arnold, Middleton, WI (US);

Harold T. Evensen, Verona, WI (US);

Gerald Joseph Brady, Madison, WI (US);

Padma Gopalan, Madison, WI (US);

Yongho Joo, Madison, WI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C01B 31/02 (2006.01); C09D 11/52 (2014.01); C09D 11/106 (2014.01); B05D 1/18 (2006.01); H01L 29/06 (2006.01); B05D 1/20 (2006.01); C09D 11/037 (2014.01); H01L 51/05 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0039 (2013.01); B05D 1/18 (2013.01); B05D 1/202 (2013.01); C01B 31/0226 (2013.01); C01B 31/0273 (2013.01); C09D 11/037 (2013.01); C09D 11/106 (2013.01); C09D 11/52 (2013.01); H01L 29/0669 (2013.01); H01L 51/0007 (2013.01); H01L 51/0043 (2013.01); H01L 51/0048 (2013.01); H01L 51/0566 (2013.01); C01B 2202/02 (2013.01); H01L 51/0558 (2013.01);
Abstract

High density films of semiconducting single-walled carbon nanotubes having a high degree of nanotube alignment are provided. Also provided are methods of making the films and field effect transistors (FETs) that incorporate the films as conducting channel materials. The single-walled carbon nanotubes are deposited from a thin layer of organic solvent containing solubilized single-walled carbon nanotubes that is continuously supplied to the surface of an aqueous medium, inducing evaporative self-assembly upon contacting a solid substrate.


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