The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Aug. 26, 2015
Applicant:
Ngk Insulators, Ltd., Aichi-prefecture, JP;
Inventors:
Sugio Miyazawa, Kasugai, JP;
Yasunori Iwasaki, Kitanagoya, JP;
Tatsuro Takagaki, Nagoya, JP;
Akiyoshi Ide, Kasugai, JP;
Hirokazu Nakanishi, Nagoya, JP;
Assignee:
NGK INSULATORS, LTD., Aichi-prefecture, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 21/20 (2006.01); C04B 35/115 (2006.01); C30B 29/06 (2006.01); C30B 33/06 (2006.01); C04B 35/632 (2006.01); C04B 35/634 (2006.01); C04B 37/00 (2006.01); C04B 35/626 (2006.01);
U.S. Cl.
CPC ...
H01L 29/16 (2013.01); C04B 35/115 (2013.01); C04B 35/6264 (2013.01); C04B 35/632 (2013.01); C04B 35/634 (2013.01); C04B 37/001 (2013.01); C04B 37/005 (2013.01); C04B 37/008 (2013.01); C30B 29/06 (2013.01); C30B 33/06 (2013.01); H01L 21/2007 (2013.01); H01L 29/0649 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/6023 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/661 (2013.01); C04B 2235/662 (2013.01); C04B 2235/786 (2013.01); C04B 2237/062 (2013.01); C04B 2237/064 (2013.01); C04B 2237/08 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/52 (2013.01); C04B 2237/588 (2013.01); Y10T 428/24355 (2015.01);
Abstract
A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 μm and a central part with an average grain size of 10 to 50 μm. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate.