The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

May. 25, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventors:

Zhenfei Cai, Beijing, CN;

Juan Fang, Beijing, CN;

Xiaomei Wei, Beijing, CN;

Min Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 27/14 (2006.01); H01L 29/15 (2006.01); H01L 31/036 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); G02F 1/1333 (2006.01); G02F 1/1343 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); G02F 1/13439 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); G02F 1/136286 (2013.01); H01L 27/1288 (2013.01); G02F 2001/136295 (2013.01);
Abstract

An array substrate is disclosed, which includes a connection structure of a second short-circuit ring and one corresponding data line, and this connection structure includes: a first electrode disposed on a base substrate; a connection line disposed on the first electrode; a first insulating layer disposed on the first electrode and the connection line, in which the data line connected with the second short-circuit ring is disposed on the first insulating layer; a second insulating layer disposed on the data line connected with the second short-circuit ring; and a second electrode disposed on the second insulating layer, in which the second electrode is connected with the data line connected with the second short-circuit ring through a first via hole and connected with the first electrode through a second via hole.


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