The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Sep. 07, 2016
Kabushiki Kaisha Toshiba, Tokyo, JP;
Atsuko Sakata, Mie, JP;
Yohei Sato, Mie, JP;
Yasuhito Yoshimizu, Mie, JP;
Satoshi Wakatsuki, Mie, JP;
Takeshi Ishizaki, Aichi, JP;
Masayuki Kitamura, Mie, JP;
Daisuke Ikeno, Mie, JP;
Tomotaka Ariga, Mie, JP;
Junichi Wada, Mie, JP;
Hiroshi Tomita, Aichi, JP;
Hisashi Okuchi, Mie, JP;
Ryohei Kitao, Mie, JP;
Toshiyuki Sasaki, Mie, JP;
Kazuhito Furumoto, Mie, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor device includes a stacked body, a semiconductor body, and a stacked film. The stacked body includes a plurality of tungsten layers and a plurality of alloy layers of tungsten and molybdenum. At least portions of the tungsten layers are stacked with an air gap interposed. The alloy layers are provided on surfaces of the tungsten layers opposing the air gap. The semiconductor body extends in a stacking direction through the stacked body. The stacked film is provided between the semiconductor body and the tungsten layers. The stacked film includes a charge storage portion.