The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Nov. 24, 2013
Applicant:

Elta Systems Ltd., Ashdod, IL;

Inventors:

Yaniv Maydar, Tel Aviv, IL;

Yohai Joseph, Petach Tiqva, IL;

Assignee:

ELTA SYSTEMS LTD., Ashdod, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/053 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01); H01L 23/055 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/147 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/46 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 23/055 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6644 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/20101 (2013.01); H01L 2924/20102 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An integrated circuit device and a method of fabricating the same are presented. The integrated circuit device () includes two or more active components (), possibly fabricated by different semiconductor technologies, and an interposer structure () adapted for carrying the two or more active components such that at least one of the active components is carried on a top surface of the interposer structure. The integrated circuit device also includes at least one metal cap (), furnished on the top surface of the interposer structure and encapsulating at least one of the active components. Some variants of the integrated circuit device of the invention are suited for operation under extreme conditions.


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