The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Feb. 04, 2016
Applicant:

Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;

Inventors:

Yiu-Wai Lai, Singapore, SG;

Da-Jung Chen, Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A package structure includes a first insulation layer, at least one first electronic component, and a first re-distribution layer. The first electronic component is embedded within the first insulation layer, and the first electronic component includes plural first conducting terminals disposed on a bottom surface of the first electronic component. At least part of the bottom surface of the first electronic component is exposed from a bottom surface of the first insulation layer. The first re-distribution layer is formed on the bottom surface of the first insulation layer and contacted with the corresponding first conducting terminals.


Find Patent Forward Citations

Loading…