The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Mar. 03, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Ichiro Kataoka, Kawasaki, JP;

Osamu Hamamoto, Isehara, JP;

Kazuya Notsu, Yokohama, JP;

Koji Tamura, Kawasaki, JP;

Kunihiko Minegishi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 24/85 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15173 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/181 (2013.01); H05K 1/0204 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10727 (2013.01); H05K 2203/0465 (2013.01);
Abstract

A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.


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