The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
May. 07, 2015
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); C08L 83/00 (2006.01); C08G 77/20 (2006.01); H01L 23/29 (2006.01); C08L 63/04 (2006.01); H01L 23/00 (2006.01); H01L 33/56 (2010.01); C09D 163/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/296 (2013.01); C08L 63/04 (2013.01); C09D 163/04 (2013.01); H01L 24/32 (2013.01); H01L 33/56 (2013.01); C08L 2205/05 (2013.01); H01L 23/295 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/186 (2013.01);
Abstract
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler: