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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9673118 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Jul. 31, 2014

Power module and method of manufacturing power module

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventor:

Masaki Taya, Chiyoda-ku, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Michael Lebentritt

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/053 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/535 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/4853 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 23/535 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/84 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 23/24 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/35 (2013.01); H01L 24/45 (2013.01); H01L 24/83 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/37005 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/37032 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/4007 (2013.01); H01L 2224/4046 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84205 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.

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