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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9673117 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Jan. 07, 2016

Semiconductor module

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Rikihiro Maruyama, Matsumoto, JP;

Takahito Harada, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Adrian S Wilson

Assistant Examiner:

Abhishek Rathod

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/28 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/24 (2006.01); H01L 21/52 (2006.01); H01L 23/08 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/52 (2013.01); H01L 23/08 (2013.01); H01L 23/24 (2013.01); H01L 23/28 (2013.01); H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 25/071 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 3/0011 (2013.01); H05K 3/303 (2013.01); H05K 3/46 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor module includes a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges excluding the first outer edge; a resin frame body having a crosspiece abutting against the first outer edges, and a frame element abutting against the second outer edges; a conductive component striding over the crosspiece to electrically connect the insulating circuit boards to each other; and an upper lid having a lid element covering an opening disposed at an upper part of the resin frame body and a partition protruding from a face of the lid element facing the insulating circuit boards to abut against a part of the crosspiece.

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