The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Jul. 09, 2014
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Jamie S. Leighton, Palo Alto, CA (US);
Yee Sheen Pong, Union City, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); H01L 21/66 (2006.01); B24B 37/005 (2012.01); B24B 49/04 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B24B 37/005 (2013.01); B24B 49/04 (2013.01); H01L 21/30625 (2013.01); H01L 21/67075 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01);
Abstract
Systems and methods are provided for controlling a polishing process in real-time. First and second characteristics are identified in first and second data sets, respectively, with each data set corresponding to a real-time wafer polishing data. A time delta is computed between the times at which the first and second characteristics occur within their respective data sets, and polishing parameters are then updated in real-time based on the computed time delta.