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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9673080 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Mar. 30, 2016

Semiconductor piece manufacturing method

Applicant:

Fuji Xerox Co., Ltd., Minato-ku, Tokyo, JP;

Inventors:

Mutsuya Takahashi, Ebina, JP;

Shuichi Yamada, Ebina, JP;

Michiaki Murata, Ebina, JP;

Assignee:

FUJI XEROX CO., LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Christine Enad

Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 33/00 (2010.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/308 (2013.01); H01L 21/3043 (2013.01); H01L 21/3065 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 33/0095 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

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