The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Oct. 26, 2015
Applicant:
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;
Inventors:
Dror Hurwitz, Zhuhai, CN;
Alex Huang, Zhuhai, CN;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 2021/60022 (2013.01);
Abstract
An electronic support structure comprising one or more layers of copper features such as copper routing layers, laminated within a dielectric material comprising continuous glass fibers in a polymer matrix wherein pairs of adjacent layers of copper features are coupled by a via layer, and where terminations on at least one side of the electronic support structure comprise a modified bond-on-trace attachment sites comprising selectively exposed top and partial side surfaces of copper features in an outer layer of copper features for conductive coupling solder.