The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Mar. 18, 2016
Applicant:

Inphi Corporation, Santa Clara, CA (US);

Inventors:

Radhakrishnan L. Nagarajan, Santa Clara, CA (US);

Peng-Chih Li, Santa Clara, CA (US);

Masaki Kato, Palo Alto, CA (US);

Chris Togami, Santa Clara, CA (US);

Assignee:

INPHI CORPORATION, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); G02B 6/38 (2006.01); G02B 6/32 (2006.01); H05K 3/30 (2006.01); H04B 1/3827 (2015.01);
U.S. Cl.
CPC ...
G02B 6/4257 (2013.01); G02B 6/32 (2013.01); G02B 6/3849 (2013.01); G02B 6/3893 (2013.01); G02B 6/4206 (2013.01); G02B 6/4208 (2013.01); G02B 6/428 (2013.01); G02B 6/4284 (2013.01); G02B 6/4292 (2013.01); G02B 6/4295 (2013.01); H04B 1/3833 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H05K 3/30 (2013.01);
Abstract

An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.


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