The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Sep. 04, 2013
University of Southern California, Los Angeles, CA (US);
Ming Ting Wu, Northridge, CA (US);
Rulon J. Larsen, III, Reseda, CA (US);
Young Kim, Sherman Oaks, CA (US);
Kieun Kim, Pasadena, CA (US);
Adam L. Cohen, Valley Village, CA (US);
Ananda H. Kumar, Fremont, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Dennis R. Smalley, Newhall, CA (US);
University of Southern California, Los Angeles, CA (US);
Abstract
Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.