The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Apr. 22, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Lam Arthur Campbell, Tomball, TX (US);

Dan Tho Lu, Minden, NV (US);

Svein Arild Haugen, Bergen, NO;

Jens Abrahamsen, Bergen, NO;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/20 (2006.01); G01L 9/08 (2006.01); G01D 11/24 (2006.01); F04D 13/08 (2006.01); E21B 47/00 (2012.01); E21B 47/01 (2012.01); H02K 11/21 (2016.01);
U.S. Cl.
CPC ...
G01D 5/20 (2013.01); E21B 47/0007 (2013.01); E21B 47/011 (2013.01); F04D 13/08 (2013.01); G01D 11/245 (2013.01); G01L 9/08 (2013.01); H02K 11/21 (2016.01);
Abstract

Sensor assemblies, electrical penetrator assemblies and associated methods are provided for monitoring operational characteristics of subsea rotating devices such as subsea motors and pumps. Pressure-compensated proximity sensors configured to withstand subsea pressures are disposed adjacent a subsea rotating shaft for directly monitoring a position of the rotating shaft during dynamic operation thereof. A sensor tip assembly includes a sensor cap and a sensing element therein configured to produce a signal indicative of a distance between the sensor cap and the rotating shaft. A substantially incompressible fluid is disposed within a fluid reservoir within a sensor housing, and fluidly communicates with the sensor cap such that at least a portion of an internal pressure within the sensor housing is applied to interior portions of the sensor cap. The sensor housing is configured such that the internal pressure increases in response to an increase in an external pressure of the sensor housing.


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