The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Nov. 18, 2013
Applicants:

Virgiliu-adrian Savu, Allen Park, MI (US);

Timothy E. Geiman, South Lyon, MI (US);

Allan Keeble, Valdese, NC (US);

Timothy Laughlin, Plymouth, MI (US);

Inventors:

Virgiliu-Adrian Savu, Allen Park, MI (US);

Timothy E. Geiman, South Lyon, MI (US);

Allan Keeble, Valdese, NC (US);

Timothy Laughlin, Plymouth, MI (US);

Assignee:

GKN Sinter Metals, LLC, Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 35/00 (2006.01); F16C 9/04 (2006.01); F16C 7/02 (2006.01); F16C 35/02 (2006.01); F16C 35/04 (2006.01);
U.S. Cl.
CPC ...
F16C 9/045 (2013.01); F16C 7/023 (2013.01); F16C 9/04 (2013.01); F16C 35/02 (2013.01); F16C 35/04 (2013.01); F16C 2226/60 (2013.01);
Abstract

A component () is adapted for contact with a mating component () during attachment of the components to one another to form a related assembly in which a deformable pad () or pads improve stress distribution. The component includes a body having an interface surface in which the body is adapted to be contacted with the mating component at the interface surface of the body. One or more deformable pads are formed in the interface surface. Each deformable pad has a top surface that is offset outwardly from the interface surface relative to the body and a groove surrounding the deformable pad that is offset inwardly from the interface surface relative to the body.


Find Patent Forward Citations

Loading…