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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9670370 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Jan. 17, 2014

Functional film manufacturing method and functional film

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Eijiro Iwase, Kanagawa, JP;

Jiro Tsukahara, Kanagawa, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorneys:

Edwards Neils LLC

Jean C. Edwards, Esq.

Primary Examiner:

Erma Cameron

Int. Cl.
CPC ...
C09D 7/12 (2006.01); B05D 1/36 (2006.01); H05B 33/04 (2006.01); B05D 7/24 (2006.01); B05D 7/04 (2006.01); B05D 7/00 (2006.01); C23C 16/34 (2006.01); C23C 16/54 (2006.01); C08J 7/04 (2006.01); H01L 51/52 (2006.01); B05D 3/04 (2006.01); B05D 3/06 (2006.01);
U.S. Cl.
CPC ...
C09D 7/1233 (2013.01); B05D 1/36 (2013.01); B05D 7/04 (2013.01); B05D 7/24 (2013.01); B05D 7/56 (2013.01); C08J 7/047 (2013.01); C23C 16/345 (2013.01); C23C 16/545 (2013.01); H05B 33/04 (2013.01); B05D 3/0406 (2013.01); B05D 3/06 (2013.01); B05D 2252/02 (2013.01); C08J 2433/06 (2013.01); H01L 51/5256 (2013.01); Y10T 428/31663 (2015.04);
Abstract

The present invention relates to a functional film and a method for manufacturing the same, the functional film being organically and inorganically laminated to have a desired function such as high gas barrier performance and having high adhesiveness between inorganic and organic layers. The organic layer on top of the inorganic layer contains an organic solvent; an organic compound formed of the organic layer; and a silane coupling agent with a concentration between 0.1 and 25 percentages by mass excluding the organic solvent, the organic layer uses a coating material not containing a pH controller, and the organic layer is formed through curing via a heating process after coating.

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