The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Aug. 14, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Wei-Hao Lai, Kaohsiung, TW;

Shih-Ming Chen, Hsinchu, TW;

Cheng-Yi Lin, Hukou Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/34 (2006.01); C08K 5/06 (2006.01); C08J 5/10 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08K 3/346 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 3/34 (2013.01); C08K 5/06 (2013.01);
Abstract

A shear thickening formulation and composite material employing the same are provided. The shear thickening formulation includes inorganic particles and polyethylene glycol. The inorganic particles and the polyethylene glycol have a weight ratio of 3 to 4. The inorganic particles can be silica, aluminum oxide, silicon carbide, nano diamond, or a combination thereof.


Find Patent Forward Citations

Lai, Wei-Hao. (2017). Shear thickening formulation and composite material employing the same (U.S. Patent No. 9670334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9670334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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