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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9670090 B1

PDFFull Text
Date of Patent:
Jun. 06, 2017

Filed:

Aug. 24, 2015

Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Takashi Naito, Tokyo, JP;

Shinichi Tachizono, Tokyo, JP;

Kei Yoshimura, Tokyo, JP;

Yuji Hashiba, Tokyo, JP;

Takuya Aoyagi, Tokyo, JP;

Taigo Onodera, Tokyo, JP;

Tatsuya Miyake, Tokyo, JP;

Assignee:

Hitachi Chemical Co. , Ltd., Tokyo, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Elizabeth A Bolden

Int. Cl.
CPC ...
C03C 3/21 (2006.01); C03C 3/12 (2006.01); C03C 8/02 (2006.01); C03C 8/14 (2006.01); H01L 31/068 (2012.01); C03C 8/24 (2006.01); H01L 31/0224 (2006.01); H01L 31/0216 (2014.01); H01L 51/52 (2006.01); H01B 1/14 (2006.01); H01L 41/053 (2006.01); C03C 8/08 (2006.01); C09D 5/24 (2006.01); C03B 23/203 (2006.01); C03C 3/14 (2006.01); C03C 8/16 (2006.01); C03C 8/18 (2006.01); H03H 9/19 (2006.01); H03H 3/02 (2006.01); H03H 9/10 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); C03B 23/203 (2013.01); C03C 3/122 (2013.01); C03C 3/14 (2013.01); C03C 3/21 (2013.01); C03C 8/02 (2013.01); C03C 8/08 (2013.01); C03C 8/14 (2013.01); C03C 8/16 (2013.01); C03C 8/18 (2013.01); C09D 5/24 (2013.01); H01B 1/14 (2013.01); H01L 31/02168 (2013.01); H01L 31/022425 (2013.01); H01L 31/068 (2013.01); H01L 41/053 (2013.01); H01L 51/5246 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/16152 (2013.01); H03H 3/02 (2013.01); H03H 9/1014 (2013.01); H03H 9/19 (2013.01); H05K 1/092 (2013.01); H05K 2203/1126 (2013.01);
Abstract

An AgO—VO—TeOlead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WOand PO; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of VO, TeOand AgO. Contents of TeOand AgO each is 1 to 2 times as much as a content of VO. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Find Patent Forward Citations

Quick Actions:

Naito, Takashi. (2017). Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same (U.S. Patent No. 9670090). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9670090

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